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HYC Certified by US Conec, Empowering Next-Gen Optical Interconnects

2025.05.12

HYC (HYC Co., Ltd.) has recently been certified by US Conec for the termination and assembly of its patented MMC connectors and TMT ferrules. With this certification, HYC is now qualified to manufacture MMC patch cords, trunks, harnesses, and more, providing reliable connectivity solutions for next-generation high-density optical interconnects.


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The MMC connector, developed by US Conec, is a new-generation Very Small Form Factor (VSFF) multi-fiber optical connector that incorporates an innovative small-format MT ferrule (TMT). This design enables higher fiber density while maintaining excellent optical performance. With its DirectConec™ push-pull boot design, the MMC connector significantly enhances field installation flexibility and efficiency—making it an ideal solution for 800G/1.6T interconnects and Co-Packaged Optics (CPO) applications.


Driven by the rapid growth of AI, big data, and cloud computing, data centers are evolving toward higher bandwidth and greater density. With approximately three times the port density of traditional MPO connectors, the MMC connector offers a high-density, high-reliability solution for future optical interconnect challenges. It is particularly well-suited for high-speed interconnect systems in hyperscale data centers.


HYC has over 20 years of experience in the R&D and manufacturing of passive optical devices, especially in fiber connectivity products. This certification marks an important milestone, empowering HYC to scale up production and accelerate deployment of MMC-based solutions, providing high-performance connectivity for next-generation of data centers.


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