The explosive growth of Artificial Intelligence (AI) and Large Language Models (LLMs) is driving an unprecedented surge in computing power and bandwidth demand for data centers. With the momentum of high-performance computing, optical transceivers are advancing at a remarkable pace — leaping from 100 Gbps and 400 Gbps to 800 Gbps, and accelerating toward 1.6 Tbps and beyond.
This speed evolution is not only a breakthrough in transmission capacity but also raises new challenges for optical connectivity: how to achieve higher density and greater reliability while maintaining ultra-high speed. As an innovator in high-speed optical fiber connectivity solutions, HYC Co., Ltd. will be showcasing its latest technologies at two major exhibitions in September 2025:
- CIOE 2025 (Shenzhen, China)
- ECOC 2025 (Copenhagen, Denmark)
At both events, HYC will present cutting-edge passive optical components and fiber connectivity solutions designed to meet the demands of next-generation data centers.
Exhibition Highlights:
1) High-Speed Optical Subassemblies for 800G/1.6T/SiPh/MCF Transceivers
HYC has developed eight basic components — MT/Mini MT, Jumper, Fiber Array (FA), Receptacle, Free-space Isolator (FSI), Fiber Lens Array, Z-Block, and Prism. By leveraging these modular platforms with advanced process design and product management, HYC provides customized optical subassemblies tailored for diverse high-speed transceiver applications.
2) MPO/MMC High-Density Cabling Solutions: Powering AI Interconnects
With deep expertise in high-density jumpers, patch panels, HYC holds multiple core technologies and patents. At CIOE and ECOC, HYC will present ultra-high-density cabling solutions for AI-driven data centers, as well as fiber interconnect solutions optimized for CPO (Co-Packaged Optics) modules.
3) MCF (Multi-Core Fiber) Subassemblies: Breaking Capacity Limits
HYC will highlight a full range of customized MCF interconnection — including MCF assemblies for next-generation transceivers, MCF FIFO assemblies for external applications, and MCF patch cords — meeting diverse application needs while unleashing the potential of multi-core fiber to expand transmission capacity.
We sincerely invite industry partners to visit HYC at CIOE 2025 and ECOC 2025, and join us in exploring the future of high-speed optical interconnects.
📍 CIOE 2025
Date: September 10–12, 2025
Venue: Shenzhen World Exhibition & Convention Center
Booth: Hall 11, #11B59
📍 ECOC 2025
Date: September 29 – October 1, 2025
Venue: Bella Center, Copenhagen, Denmark
Booth: C2413
