HYC Co., Ltd. (HYC) has officially joined the Advanced Photonics Coalition (APC), signaling the company’s commitment to playing a more active role in shaping silicon photonics technologies and next-generation optical interconnect standards. Through this collaboration, HYC will work with global industry partners to foster an open and scalable photonics ecosystem.
The APC is a non-profit industry organization focused on silicon photonics standards, dedicated to advancing the scalability and standardization of silicon photonics manufacturing through open-source collaboration. The coalition brings together stakeholders across the photonics supply chain, promoting practical manufacturing standards, reducing barriers for emerging technologies, and creating opportunities for diverse supplier engagement. The organization currently includes more than 50 companies worldwide, spanning photonics devices, chips, systems, and solutions.
As a leader in the field of passive optical components, HYC continues to strengthen its technology portfolio for next-generation data center optical interconnects, with strategic focus on Co-Packaged Optics (CPO) and Multi-Core Fiber (MCF).
CPO, as a critical technology for high-density optical interconnects, plays a central role in overcoming bandwidth bottlenecks in large-scale AI systems. For CPO applications, HYC offers high-precision pitch Fiber Array Units (FAU), shuffle box, and detachable connectors to address high-density interconnection and maintainability challenges in CPO architectures. Leveraging its technical expertise, HYC actively participates in standardization efforts and industry collaborations, promoting the development of an open and scalable CPO ecosystem.
MCF is recognized as a key technology to overcome the capacity limits of traditional single-core fibers. HYC has made forward-looking investments in MCF technology, establishing a comprehensive product portfolio in this field and ready for volume production. Utilizing proprietary technology platforms, HYC has built a complete series of multi-core fiber passive components, including MCF FIFO, MCF patch cords, MCF FAUs, and MCF hybrid subassemblies, providing critical optical interconnect solutions for next-generation architectures.
Upon joining the APC, HYC will fully leverage its technical expertise in passive optical components to actively participate in the alliance’s specialized working groups and industry collaborations focused on key areas such as CPO optical interfaces and multi-core fiber interconnects. Together with global industry partners, HYC will drive the standardization and large-scale adoption of Silicon Photonics and new fiber interconnect technologies, contributing significantly to the open and efficient development of next-generation data center optical interconnects.
