OFC 2026 successfully concluded on March 19 in Los Angeles. During the three-day event, HYC presented four key passive optical solution portfolios, including a full range of multicore fiber (MCF) products, CPO-related optical interconnect solutions, ultra-high-density connectivity, and optical subassemblies for high-speed transceivers. The showcase attracted strong interest and in-depth engagement from industry partners across the global optical communications ecosystem.
Comprehensive MCF Portfolio Showcased
At the event, HYC showcased a comprehensive multicore fiber portfolio covering MCF Fan-In/Fan-Out (FIFO), MCF patch cords, MCF FAU, and hybrid assemblies—addressing applications from device-level integration to system-level interconnects.
Among these, MCF FIFO drew particular attention as a key enabling component for efficient coupling between multi-core fibers and single-core fibers. Live demonstrations highlighted its role in supporting next-generation optical architectures.
To meet diverse application needs, HYC offers multiple implementation approaches, including 3D waveguide (femtosecond laser direct writing), bundle technology, and free space optics technology, allowing flexible optimization across performance, cost, and integration requirements.
As discussions around next-generation interconnect architectures continue to evolve, multicore fiber is increasingly recognized for its potential to significantly enhance transmission capacity while improving space efficiency—making it a central topic throughout the exhibition.
Advancing Optical Interconnects for CPO
HYC also presented key passive optical component solutions designed for co-packaged optics (CPO), including high-precision pitch FAU and Fiber Shuffle. Discussions with visitors focused on critical factors such as manufacturing consistency, yield performance, and scalable delivery.
Backed by a development strategy that integrates advanced equipment, in-house process development, and internal engineering capabilities, HYC has established a precision manufacturing platform capable of achieving sub-micron-level consistency in V-groove fabrication, angular alignment, and end-face quality control. This enables both high-precision V-groove mass production and reliable, scalable FAU manufacturing—providing a solid foundation for CPO deployment.
HYC’s Fiber Shuffle solution further enhances high-density optical routing. Built on an automated fiber cabling platform, it supports fully automated routing design and volume production, with fully customizable fiber paths and precise control of fiber length.
Capable of organizing hundreds to thousands of fibers according to predefined routing matrices, the Fiber Shuffle enables efficient high-density optical cabling. The solution is available in multiple form factors, including flexible circuit, Shuffle Boxes, Fiber Shuffle patch cords, and Shuffle patch panels, and is widely deployed in Spine-Leaf architectures, CPO switches, and optical circuit switch (OCS) systems.
Through its participation at OFC 2026, HYC not only demonstrated its capabilities in high-speed optical interconnect technologies, but also strengthened engagement with global customers and partners.
Looking ahead, HYC will continue to focus on the evolution of multicore fiber and CPO technologies, driving innovation and enabling scalable optical interconnect solutions for AI-driven data centers and high-performance computing applications.
